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Technical specifications

Complete technical parameters and manufacturing capabilities for prototype PCBs.

ParameterValue
Number of layers
2, 4
Coming soon: 6–12 L
Material
FR4
Maximum dimensions
155 × 130 mm
Minimum dimensions
10 × 10 mm
Copper thickness
25 μm, 35 μm
Coming soon: 70 μm
Surface finish
Immersion Tin
Coming soon: ENIG, ImAg
Minimum silkscreen print width
0.15 mm
Minimum font height
1 mm
ParameterValue
Minimum PTH diameter
0.3 mm
Minimum NPTH diameter
0.5 mm
Minimum annular ring around hole
0.12 mm
Minimum hole edge-to-edge distance
0.2 mm
Minimum board edge-to-hole edge distance
0.2 mm
ParameterValue
Minimum trace width
0.2 mm
Minimum trace spacing
0.2 mm
ParameterValue
Solder mask color
Green, black, red, blue
ParameterValue
Copper clearance from edge/slot
Copper may be flush with the edge

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